Tag Archive: Adhes Dent

9 02 2011

The effects of cavity size and filling method on the bonding to Class I cavities.

The effects of cavity size and filling method on the bonding to Class I cavities. J Adhes Dent. 2008 Dec;10(6):447-53 Authors: He Z, Shimada Y, Sadr A, Ikeda M, Tagami J Abstract PURPOSE: The effects of incremental filling technique and flowable liner on the bond strength of resin composite in different sized cavities were investigated …

続きを読む »

9 02 2011

Microtensile bond strength of etch-and-rinse and self-etching adhesives to intrapulpal dentin after endodontic irrigation and setting of root canal sealer.

Microtensile bond strength of etch-and-rinse and self-etching adhesives to intrapulpal dentin after endodontic irrigation and setting of root canal sealer. J Adhes Dent. 2009 Feb;11(1):57-64 Authors: Wattanawongpitak N, Nakajima M, Ikeda M, Foxton RM, Tagami J Abstract PURPOSE: To evaluate the effect of endodontic irrigation regimens and calcium hydroxide root canal sealer (Sealapex) on the …

続きを読む »

9 02 2011

Effect of Er:YAG laser treatment on the microstructure of the dentin/adhesive interface after acid-base challenge.

Effect of Er:YAG laser treatment on the microstructure of the dentin/adhesive interface after acid-base challenge. J Adhes Dent. 2007 Dec;9(6):513-20 Authors: Bakry AS, Sadr A, Inoue G, Otsuki M, Tagami J Abstract PURPOSE: The aim of this study was to evaluate the effect of Er:YAG laser ablation on the microstructure of the dentin/adhesive interface after …

続きを読む »

9 02 2011

Influence of hydrostatic pulpal pressure on the microtensile bond strength of all-in-one self-etching adhesives.

Influence of hydrostatic pulpal pressure on the microtensile bond strength of all-in-one self-etching adhesives. J Adhes Dent. 2007 Oct;9(5):437-42 Authors: Hosaka K, Nakajima M, Monticelli F, Carrilho M, Yamauti M, Aksornmuang J, Nishitani Y, Tay FR, Pashley DH, Tagami J Abstract PURPOSE: To evaluate the microtensile bond strength (microTBS) of two all-in-one self-etching adhesive systems …

続きを読む »

» 新しい記事へ